Packaging for 3D/2.5D IC integration 

As IC technology advances, the need for more reliable and efficient packaging solutions is becoming increasingly important. With the emergence of 3D/2.5D IC integration, the complexity of semiconductor packaging has increased significantly. 3D/2.5D IC integration involves stacking multiple layers of ICs together in a single package. The layers are connected using through-silicon vias (TSVs) and microbumps. This type of integration provides a more efficient and cost effective solution compared to traditional 2D packaging. However, the complexity of 3D/2.5D IC integration requires more advanced semiconductor packaging solutions.

When packaging 3D/2.5D ICs, the semiconductor packaging material must be able to handle the increased complexity and provide reliable electrical connections between the layers. The materials must also be able to withstand the extreme temperatures and pressures that occur during manufacturing and operation. Additionally, the semiconductor packaging must be able to handle the high density of interconnects between the layers.

At Nanosystems JP, we provide a range of high-performance 3D/2.5D IC packaging fabrication services to meet the most demanding requirements. Allowing highest levels of performance and reliability, enabling customers to achieve the highest levels of design, power and thermal efficiency.

TSV

Typical Process Flow

  1. TSV Fabrication

TSV

TSV in a Silicon wafer

2. Backside processing

  1. TSV reveal

Diagram showing layers of a semiconductor structure, including a carrier wafer at the bottom, an adhesive layer in the middle, and a SiN/SiO2 layer on top with vertical connections passing through all layers.
Diagram showing semiconductor structure with labeled layers including Carrier Wafer, RDL1, and RDL2.

3.UBM and C4 Bumping

Cross-section diagram of a semiconductor package showing layers, with labels for RDL1, RDL2, and carrier wafer. Various materials and structures are depicted, indicating different stages in the packaging process.

3.Frontside processing

  1. Frontside RDL

Diagram of RDL1 and RDL2 layers on a semiconductor with a carrier wafer at the bottom. Various colored sections represent different layers and components of the structure.

2. Frontside UBM & Cu post or Pillars fabrication

Chip | Wafer

Layered semiconductor architecture diagram showing chips, redistribution layers (RDL1 and RDL2), conductive pathways, and substrate connections.

3. Package substrate

Schematic diagram of semiconductor packaging layers with labeled RDL1 and RDL2, featuring various colored sections and circular elements.

4. Under filling and molding

Diagram of a flip-chip semiconductor structure with labeled layers including RDL1, RDL2, and interconnected lines.
Yellow square labeled "Underfill" and light blue square labeled "Mold."

If you have any questions about our Packaging for 3D/2.5D IC integration fabrication process, please don't hesitate to contact us.