Tokyo, Japan

Pure-play foundry
from Japan

At Nanosystems JP Inc., we specialize in comprehensive semiconductor, MEMS, and nano-fabrication foundry services , from substrate procurement through to diced chips, delivered worldwide.

Who We Are
Empowering engineers and researchers
to accelerate technological development

We are a Japanese company based in Tokyo. At Nanosystems JP Inc., we offer wafer-level semiconductor, MEMS, and nano-micro fabrication prototyping and production solutions. We manage the process from substrate procurement through to the delivery of the final diced chip , offering tailored fabrication solutions spanning single-wafer prototyping to volume production.

Japanese precision

Cleanroom fabrication to ISO standards, executed with the precision and attention to detail Japan is known for globally.

End-to-end

Substrate to diced chip : substrate procurement, all fabrication processes, dicing, and inspection under a single project.

Accessible

Small-lot prototyping from 1–5 wafers with no prohibitive minimums. R&D through to production scale without changing foundry.

IP protection

NDA available before you share any design details. Your technology stays protected from first contact to final delivery.

Technical partner

Dedicated process engineers , not just a quotation desk. Technical review, feasibility assessment, and ongoing project support.

Global reach

Ships worldwide. Accessible to international customers with English-language project support.

Nanosystems JP Inc. - Marunouchi Trust Tower, Tokyo
Where We Are
Based in central Tokyo

Nanosystems JP Inc. is headquartered at Marunouchi Trust Tower , in the heart of Tokyo's business district, minutes from Tokyo Station.

Nanosystems JP Inc.
株式会社ナノシステムズJP
Open in Google Maps
Address

Nanosystems JP Inc.
株式会社ナノシステムズJP
Level 20, Marunouchi Trust Tower
1-8-3 Marunouchi, Chiyoda-Ku
Tokyo 100-0005, Japan

Contact

[email protected]
📞 +81-3-5288-5569
🌐 www.nanosystemsjp.co.jp

Follow Us
Follow on LinkedIn
Our Capabilities
20+ processes across the full semiconductor fabrication flow

At Nanosystems JP Inc., we offer a complete range of front-end and back-end semiconductor processes , from bare substrate to fully packaged chip.

Core Semiconductor

Front-End Processes

Substrate procurement, mask fabrication, photolithography (20nm–4µm), nanoimprinting, thin film deposition (100+ materials), electroplating, etching, annealing, ion implantation, CMP, and dicing.

Advanced Packaging

3D IC & Interposers

TSV fabrication, TSV reveal, TGV fabrication, wafer bonding (8+ methods), RDL fabrication, UBM, C4 bumping, AuSn bump services for silicon photonics, and full packaging assembly.

Specialty

Biochip & Photonics

Glass/silicon/polymer biochip fabrication, organ-on-chip, MEA devices, silicon photonics waveguide processing, LIGA electroforming, and roll-to-roll thin film deposition.

Full capabilities list →
Start a Project
Get in touch with our team

At Nanosystems JP Inc., a process engineer will review your inquiry personally. We respond within 1 business day, with a full quote typically within 7–10 business days, subject to project complexity and NDA requirements.

📋
What to include

Process requirements, substrate type and size, production volume, and your target timeline. GDS/DXF files are not required at this stage.

🔒
NDA available

An NDA can be arranged before any design files or technical details are shared - just mention it in your first message.

Response time

Initial response within 1 business day. Full quote within 7–10 business days once all project information is confirmed.

[email protected] · +81-3-5288-5569 · NDA available on request · All data handled confidentially

Technical AI — Nanosystems JP Inc.
Online — typically replies in minutes