Our pure-play foundry model means we fabricate for any industry that requires semiconductor precision. These are our primary verticals, but if your device needs a cleanroom, contact us.
Automotive
MEMS accelerometers and gyroscopes for airbag and VDC systems. SiC MOSFET and GaN power devices for EV traction inverters and on-board chargers. MEMS LiDAR scanning mirrors for autonomous driving perception. Pressure, gas, humidity, and temperature sensors for engine management and cabin comfort.
Fabrication processes: DRIE, ion implantation and activation annealing up to 1800°C for SiC, wafer bonding (anodic + AuSn hermetic), annealing, heavy Al wire bonding for power modules.
Photonics & Silicon Photonics
SOI waveguide patterning, grating coupler e-beam lithography, ICP-RIE etch, and AuSn flip-chip laser integration for silicon photonic PICs. TSV and TGV interposers for co-packaged optics modules at 400G/800G/1.6T. AR/VR waveguide combiners and metasurface flat optics by NIL. MEMS optical switches and tunable filters.
Stealth laser dicing preserves waveguide facets. All photonic process steps, run as one continuous flow.
Life Sciences & Biomedical
Organ-on-chip PDMS platforms, micro-electrode arrays for neural recording, DNA sequencing flow cells, LSPR biosensors, LIGA microneedles, and implantable neural probes. Glass biochip arrays on 500×600mm panels for low-cost-per-chip diagnostic production. PDMS prototype in 3-5 days. COP injection-molded production chips.
Biocompatible materials throughout: ISO 10993 polyimide, Pd-Ni electroforming, Au/Pt electrodes.
Startup & Venturing
Hardware startups developing MEMS sensors, photonic devices, biochips, power semiconductors, or any novel semiconductor device can access our full 20-process foundry from a single prototype wafer. Under 45 days. NDA available on request.
From concept through prototype to repeat production on one established recipe, managed end to end by a dedicated project manager.
AI & High-Performance Computing
3D-IC HBM stacking for AI accelerators (GPU, TPU, NPU). 2.5D chiplet integration on silicon or glass interposers. TSV fabrication, TSV reveal, RDL, and C4 bumping, the full advanced packaging stack for HPC chiplet designs. TGV glass interposers + silicon TSV interposers for next-generation AI module packaging.
5G/6G & RF Communication
GaAs, InP, and GaN MMIC fabrication for 5G/6G front-end modules. BCB (k=2.65) passivation for mmWave signal integrity. TGV glass interposers for low-loss RF routing. AuSn flip-chip for fluxless mmWave assembly. RF MEMS switches with hermetic AuSn packaging.
Energy & Power Electronics
SiC and GaN power device fabrication for solar inverters, EV charging infrastructure, industrial motor drives, and grid storage. Silver sinter die attach and heavy Al wire bonding for power module assembly. DPC on AlN ceramic for thermally demanding packaging.
Space & Defense
High-reliability semiconductor fabrication with full lot traceability, from wafer-level processing through hermetic package assembly. Au wire bonding with MIL-STD-883 compatible practices. Radiation-tolerant 3D-IC stacking. Export-controlled handling where required.
Industrial & Scientific Instruments
Precision MEMS sensors for industrial process monitoring, scientific instruments, and environmental sensing. MEMS pressure sensors, flow sensors, gas sensors, and optical spectrometers. Large-format glass substrates for laboratory instrument components.
Deep-Tech Research
University and corporate R&D groups fabricating novel devices, quantum photonic chips, metamaterial sensors, piezoelectric MEMS, MEMS energy harvesters, and nanofluidic research platforms. From 1 wafer. Fast iteration. Engineering consultation included.
Your IP stays yours
Nanosystems JP Inc. does not design, manufacture, or sell semiconductor devices. We fabricate exclusively for our customers. Your device designs, process parameters, and IP are protected from day one.
All 20 processes
DRIE, lithography, thin film deposition, ion implantation, wafer bonding, TSV/TGV, RDL, AuSn bumping, and packaging, all managed as one project. All steps run as one continuous project, no coordination delays between them.
From 1 wafer, every process, every industry
The minimum run size for every process in our portfolio is one wafer. Whether you are a corporate R&D lab or a hardware startup, you can prototype any device without minimum lot commitments.
English-speaking engineers for global customers
Located in Tokyo, serving global customers entirely in English. Technical consultation, quotation, and project management all in English, no language barrier between your concept and its fabrication.
NDA available on request
An NDA can be arranged before any design files, specifications, or device parameters are shared, just mention it in your first message. Inquiries and quotes can proceed without one, and your information is treated confidentially from the first contact regardless.
Japan quality, accessible globally
Japanese manufacturing quality standards, process discipline, and reliability, with an English-language interface that makes Japan-based foundry services accessible to teams worldwide.
Start your project.
Initial response within one business day.
Share your process requirements, substrate, and production volume. A Nanosystems JP Inc. engineer will give an initial response within one business day. Full quote typically within 7-10 business days, subject to project complexity and NDA requirements.