Fused Silica Wafers
& Substrates
Precision-grade SiO₂ wafers for optical, MEMS, thin film, and photonic applications - available in all major purity classifications, standard and custom dimensions, with optical surface finishes to your specification.
available
diameter range
surface finish (nm)
tolerance
From substrate procurement
to finished device
Nanosystems JP Inc. supplies fused silica wafers and substrates to support device development across optics, MEMS, semiconductor packaging, and photonics. We handle standard grade procurement and custom specifications - including non-standard diameters, tailored thicknesses, and specified surface finishes - as part of a complete fabrication engagement. When your project requires TGV drilling, thin film deposition, lithography, or dicing on the same material, those steps are managed as one project.
All major fused silica grades
Fused silica is produced by several methods, each yielding different OH content and spectral performance. The table below outlines the four primary grades and their typical application domains. Grade designations follow the JGS classification system widely used across Asia and internationally.
| Grade | Production Method | OH Content | UV Cutoff | IR Cutoff | Primary Applications |
|---|---|---|---|---|---|
| JGS1 | Oxyhydrogen flame synthesis (synthetic SiO₂) | ~200 ppm | ~170 nm | ~2.5 µm | Deep-UV optics, excimer laser components, UV lithography windows, photomask substrates |
| JGS2 | Gas-refined natural quartz fusion | ~150 ppm | ~220 nm | ~2.5 µm | Visible and near-UV optics, MEMS device substrates, hermetic packaging windows |
| JGS3 | Electric fusion of natural quartz | <10 ppm | ~260 nm | ~3.5 µm | Mid-IR and thermal imaging optics, infrared spectroscopy windows, IR sensor covers |
| Synthetic Quartz | CVD / flame hydrolysis (ultra-pure) | Grade-specific | ~160 nm | ~2.5 µm | DUV lithography, high-power laser systems, semiconductor photomasks, precision interferometry |
Cutoff wavelengths are indicative at typical transmission threshold (≥10%). Actual performance varies by sample thickness and surface condition. Contact us if your drawing references a regional grade name or alternative designation, we can confirm the appropriate equivalent.
Wafer sizes, thickness &
surface finish options
Standard stock covers the most common wafer sizes and finish grades. Custom dimensions are available on request with typical lead times discussed at inquiry stage.
⬛ Wafer Diameter
- 1 inch (25.4 mm)
- 2 inch (50.8 mm)
- 4 inch (100 mm)
- 6 inch (150 mm)
📏 Thickness
- Standard stock: 200 µm - 2 mm
- Ultra-thin: <200 µm (custom)
- Thick substrates: >2 mm (custom)
- Tolerance: ±10 µm on custom orders
🔬 Surface Finish
- Standard optical polish - Ra <1 nm (scratch-dig specified independently)
- High-precision polish - Ra <0.5 nm (scratch-dig specified independently)
- Single-side or double-side polished
- Unpolished / as-cut (for non-optical use)
📐 Additional Options
- SEMI-standard orientation flat - 4" and 6" wafers
- Notched wafers on request
- Edge polish and edge exclusion to spec
- Wafer inspection report available
Non-standard specifications
Standard grades do not always match design requirements. We supply custom fused silica wafers tailored to your project, and coordinate any additional processing steps as a single engagement.
Custom specification capabilities
Submit your drawing or spec sheet and we will quote substrate supply, surface processing, and any downstream fabrication steps - managed as one project at Nanosystems JP Inc.
- Custom thickness specified to ±10 µm tolerance
- Custom diameter or square / rectangular substrates
- Specified surface quality grade (Ra, scratch-dig, or flatness class)
- Anti-reflection, high-reflection, or metal film coatings
- ITO (indium tin oxide) deposition for electrooptic applications
- Pre-drilled TGV for hermetic packaging or interposer applications
- Combined lithography, etching, or thin film on the same wafer
- Small R&D lots accepted - no minimum order quantity
One wafer, annotated
The whole program on one drawing: polish grade, tolerances, through-glass holes, and chip-scale formats.
Where fused silica is specified
Fused silica is selected when silicon or borosilicate glass cannot meet the optical, thermal, or chemical requirements of the application. Common use cases include:
TGV Interposers
Fused silica is our preferred glass for TGV (through-glass via) formation. Its low CTE, UV transparency, and chemical resistance make it well-suited for 2.5D packaging and optical interposer applications. We supply the substrate and drill the vias as a coordinated service.
Photonic & Optical
The broad transmission window (UV to mid-IR), negligible autofluorescence, and low thermal expansion make fused silica the standard choice for optical windows, waveguide substrates, and components in high-power laser systems.
Biomedical & Microfluidics
Chemical inertness, optical clarity across UV/visible wavelengths, and compatibility with standard semiconductor etching processes make fused silica a strong substrate choice for lab-on-chip devices, biosensor windows, and implantable optical components.
One project for substrate
and fabrication
Multi-region supply chain access
We source from both Japanese domestic and internationally recognized fused silica supply chains, giving you access to the appropriate grade and format in one project.
Substrate and fabrication in one project
When your fused silica wafer needs TGV drilling, thin film deposition, lithography, etching, or dicing, those steps are managed as one project. One quote, one point of contact.
R&D and small-lot quantities
No minimum order quantity for standard grades. Prototype and R&D quantities are accepted - from a single wafer up to engineering lot quantities - with the same process rigor as production orders.
Grade cross-referencing and specification support
If your drawings reference a regional grade name or a datasheet specification rather than a JGS grade, our team can confirm the appropriate supply and verify compatibility with your process requirements.
Request fused silica substrates.
Initial response within one business day.
Share your grade requirement, wafer size, thickness, surface finish, and quantity. A Nanosystems JP Inc. engineer will give an initial response within one business day. Full quote typically within 7-10 business days, subject to custom specification requirements and NDA.
sales@nanosystemsjp.co.jp · NDA available on request · Initial response within one business day