At Nanosystems JP Inc., we specialize in comprehensive semiconductor, MEMS, and nano-fabrication foundry services, from substrate procurement through to diced chips, delivered worldwide.
We are a Japanese company based in Tokyo. At Nanosystems JP Inc., we offer wafer-level semiconductor, MEMS, and nano-micro fabrication prototyping and production solutions. We manage the process from substrate procurement through to the delivery of the final diced chip, offering tailored fabrication solutions spanning single-wafer prototyping to volume production.
Cleanroom fabrication to ISO standards, executed with the precision and attention to detail Japan is known for globally.
Substrate to diced chip: substrate procurement, all fabrication processes, dicing, and inspection under a single project.
Small-lot prototyping from 1-5 wafers with no prohibitive minimums. R&D through to production scale without changing foundry.
NDA available before you share any design details. Your technology stays protected from first contact to final delivery.
Dedicated process engineers, not just a quotation desk. Technical review, feasibility assessment, and ongoing project support.
Global logistics and English-language technical support for international R&D teams.
Nanosystems JP Inc. is headquartered at Marunouchi Trust Tower, in the heart of Tokyo's business district, minutes from Tokyo Station.
Nanosystems JP Inc.
株式会社ナノシステムズJP
Level 20, Marunouchi Trust Tower
1-8-3 Marunouchi, Chiyoda-Ku
Tokyo 100-0005, Japan
✉ [email protected]
📞 +81-3-5288-5569
🌐 www.nanosystemsjp.co.jp
At Nanosystems JP Inc., we offer a complete range of front-end and back-end semiconductor processes, from bare substrate to fully packaged chip.
Substrate procurement, mask fabrication, photolithography (20nm-4µm), nanoimprinting, thin film deposition (100+ materials), electroplating, etching, annealing, ion implantation, CMP, and dicing.
TSV fabrication, TSV reveal, TGV fabrication, wafer bonding (8+ methods), RDL fabrication, UBM, C4 bumping, AuSn bump services for silicon photonics, and full packaging assembly.
Glass/silicon/polymer biochip fabrication, organ-on-chip, MEA devices, silicon photonics waveguide processing, LIGA electroforming, and roll-to-roll thin film deposition.
At Nanosystems JP Inc., a process engineer will review your inquiry personally. We respond within 24 hours, with a full quote typically within 7-10 business days, subject to project complexity and NDA requirements.
Have full specs ready? Submit a detailed Technical RFQ →
Process requirements, substrate type and size, production volume, and your target timeline. GDS/DXF files are not required at this stage.
An NDA can be arranged before any design files or technical details are shared, just mention it in your first message.
Initial response within 24 hours. Full quote within 7-10 business days once all project information is confirmed.