Precision-grade SiO₂ wafers for optical, MEMS, thin film, and photonic applications - available in all major purity classifications, standard and custom dimensions, with optical surface finishes to your specification.
Nanosystems JP Inc. supplies fused silica wafers and substrates to support device development across optics, MEMS, semiconductor packaging, and photonics. We handle standard grade procurement and custom specifications - including non-standard diameters, tailored thicknesses, and specified surface finishes - as part of a complete fabrication engagement. When your project requires TGV drilling, thin film deposition, lithography, or dicing on the same material, those steps are managed as one project.
Fused silica is produced by several methods, each yielding different OH content and spectral performance. The table below outlines the four primary grades and their typical application domains. Grade designations follow the JGS classification system widely used across Asia and internationally.
| Grade | Production Method | OH Content | UV Cutoff | IR Cutoff | Primary Applications |
|---|---|---|---|---|---|
| JGS1 | Oxyhydrogen flame synthesis (synthetic SiO₂) | ~200 ppm | ~170 nm | ~2.5 µm | Deep-UV optics, excimer laser components, UV lithography windows, photomask substrates |
| JGS2 | Gas-refined natural quartz fusion | ~150 ppm | ~220 nm | ~2.5 µm | Visible and near-UV optics, MEMS device substrates, hermetic packaging windows |
| JGS3 | Electric fusion of natural quartz | <10 ppm | ~260 nm | ~3.5 µm | Mid-IR and thermal imaging optics, infrared spectroscopy windows, IR sensor covers |
| Synthetic Quartz | CVD / flame hydrolysis (ultra-pure) | <1 ppm | ~160 nm | ~2.5 µm | DUV lithography, high-power laser systems, semiconductor photomasks, precision interferometry |
Cutoff wavelengths are indicative at typical transmission threshold (≥10%). Actual performance varies by sample thickness and surface condition. Contact us if your drawing references a regional grade name or supplier-specific designation - we can confirm the appropriate equivalent.
Standard stock covers the most common wafer sizes and finish grades. Custom dimensions are available on request with typical lead times discussed at inquiry stage.
Standard grades do not always match design requirements. We supply custom fused silica wafers tailored to your project, and coordinate any additional processing steps as a single engagement.
Submit your drawing or spec sheet and we will quote substrate supply, surface processing, and any downstream fabrication steps - managed as one project at Nanosystems JP Inc.
Fused silica is selected when silicon or borosilicate glass cannot meet the optical, thermal, or chemical requirements of the application. Common use cases include:
Fused silica is our preferred glass for TGV (through-glass via) formation. Its low CTE, UV transparency, and chemical resistance make it well-suited for 2.5D packaging and optical interposer applications. We supply the substrate and drill the vias as a coordinated service.
The broad transmission window (UV to mid-IR), negligible autofluorescence, and low thermal expansion make fused silica the standard choice for optical windows, waveguide substrates, and components in high-power laser systems.
Chemical inertness, optical clarity across UV/visible wavelengths, and compatibility with standard semiconductor etching processes make fused silica a strong substrate choice for lab-on-chip devices, biosensor windows, and implantable optical components.
We source from both Japanese domestic and internationally recognized fused silica supply chains, giving you access to the appropriate grade and format without managing multiple suppliers.
When your fused silica wafer needs TGV drilling, thin film deposition, lithography, etching, or dicing, those steps are managed as one project. One quote, one point of contact.
No minimum order quantity for standard grades. Prototype and R&D quantities are accepted - from a single wafer up to engineering lot quantities - with the same process rigor as production orders.
If your drawings reference a supplier-specific designation, a regional grade name, or a datasheet specification rather than a JGS grade, our team can confirm the appropriate supply and verify compatibility with your process requirements.
Share your grade requirement, wafer size, thickness, surface finish, and quantity. A Nanosystems JP Inc. engineer will respond within 1 business day. Full quote typically within 7–10 business days, subject to custom specification requirements and NDA.
sales@nanosystemsjp.co.jp · NDA available on request · Response within 1 business day