Front-End Processes : Step 2 of 11

Design & Mask
Fabrication

Chrome-on-glass photomasks, metal shadow masks, and full CAD design conversion, GDS, DXF, DWG, PDF, or hand drawings accepted. 3-day quote, no minimum order.

GDS · DXF · DWG Chrome-on-glass · 0.5µm CD Laser mask ±10µm Electroformed Ni 30µm aperture Wet etch PCM · Half-etch step Solder paste stencil · Evaporation mask CAD conversion + DRC 600×600mm max sheet
0.5µm
Min photomask CD
standard grade
30µm
Min aperture
electroformed Ni
600mm
Max metal mask
sheet size
3 days
Quote turnaround
no minimum order
GDS / DXF / DWG accepted
Customer drawing conversion
Chrome-on-glass photomasks
Metal mask wet etching
NDA & IP protection
Response within 1 business day
Our Services

Three disciplines,
one partner

At Nanosystems JP Inc., we handle the full workflow. Submit any format of design data, and our engineers convert, verify, and fabricate to your exact specifications.

01 /
CAD / GDS Design

Design Conversion & CAD Services

Send us your customer drawing, sketch, or any existing CAD file. Our engineers convert it to production-ready GDS-II, DXF, or DWG format with full DRC verification. We also provide original mask layout design from your process specification.

Submit a drawing →

Accepted input formats:

GDS-II (.gds)
OASIS (.oas)
DXF (.dxf)
DWG (.dwg)
DWF (.dwf)
Gerber (.gbr)
PDF drawing
Customer sketch
Input: GDS formatsGDS-II, OASIS, CIF
Input: CAD formatsDXF, DWG, DWF, SVG
Input: OtherGerber, PDF, scanned drawing
Output formatsGDS-II, OASIS, DXF, PDF
DRC / LVSIncluded with all orders
Layer countUp to 256 layers
Conversion turnaround3–5 business days
Original layout designAvailable (from spec)
Quote turnaround3 business days
Minimum order1 mask (no minimum)
Inspection dataIncluded with every mask
PackagingMask box + N₂ purge
ShippingWorldwide tracked
NDAMutual NDA on request
02 /
Photomask Fabrication

Chrome-on-Glass Photomask

Precision photomask fabrication on soda-lime, borosilicate, or fused silica glass substrates. Chrome pattern by direct-write e-beam or laser writing. Suitable for all photolithography aligners and steppers from contact to projection.

Pattern methodE-beam / Laser direct-write
Min. CD0.5µm
CD uniformity (3σ)±50nm
Overlay accuracy±150nm
Chrome thickness~80nm (standard)
Soda-lime4", 5", 6"
Borosilicate4", 5", 6", 7", 9"
Fused silica / Quartz4", 5", 6", 9"
Flatness (quartz)<0.5µm
InspectionCD-SEM + defect scan
Pellicle optionAvailable on request
Lead time7–14 business days
Photomask details →
03 /
Metal Mask, Three Routes

Metal Mask Fabrication

Three complementary fabrication methods, matched to your feature size, material, and application. Solder paste stencils (PCB/electronics), OLED evaporation masks, semiconductor deposition masks, and MEMS shadow masks, all from the same coordinated project.

Route A
Wet Etch (PCM)
Photochemical Machining

Photoresist patterned on both sides of metal sheet, simultaneously etched through. Cost-effective for prototypes to medium volumes. Taper on sidewalls (~10% of thickness). Best for apertures ≥1× sheet thickness.

MaterialsSUS304 · SUS316 · Ni · Mo · Cu
Thickness20µm – 500µm
Min aperture≥ 1.0× t
Tolerance±10µm (standard)
Max sheet300mm × 300mm
Half-etch stepAvailable
Route B
Most popular · Fast turnaround
Laser Cut
Fiber Laser · Trepanning

Fiber laser trepanning cuts sharp-edged apertures with no photomask required. Vertical sidewalls with minimal taper (<10% of t). Next-day possible for small jobs. Best choice for solder paste stencils and standard deposition masks.

MaterialsSUS301 · SUS304 (HA/TA)
Thickness30µm – 200µm
Shape guarantee±10µm
Taper(B−A) ≤ t × 10%
Max sheet600mm × 600mm
No photomaskDirect from Gerber / DXF
Route C
Electroformed Ni
Additive · Electroforming

Nickel built up by electroforming (plating deposition) around a photoresist master. Achieves the smoothest possible aperture walls, best paste and material release. Minimum 30µm aperture opening. For fine-pitch BGA, micro-LED, and advanced OLED.

MaterialNickel (Ni) · Hv ~370
Thickness30µm – 200µm
Min aperture30µm opening
Shape guarantee±10µm
Max sheet600mm × 500mm
Lead time~2 weeks standard
All metal mask details →
Related Service
Nanoimprint Mold
Fabrication
At Nanosystems JP Inc., we offer NIL master mold fabrication across all four mold types - silicon (e-beam + DRIE), quartz (e-beam + etch), electroformed nickel, and polymer. E-beam direct-write to 20nm resolution on Si or quartz or fused silica masters, DRIE for high-aspect-ratio features, and Ni electroforming for production-durable molds. The same photomask and CAD workflow feeds directly into NIL mold fabrication.
Si, e-beam + DRIE
Quartz, e-beam + etch
Ni, electroformed
Polymer soft mold
~20nm min feature
Up to 8 inch
Si master
~20nm
e-beam + DRIE
Quartz / fused silica master
~20nm
e-beam + etch
Ni master
Sub-µm
electroformed
Polymer mold
~1µm
cast from Si
How It Works

From your file
to finished mask

Submit any format. Our engineers handle the rest, conversion, verification, writing, and quality inspection, before shipment to your lab worldwide.

01

Submit Design

Upload GDS, DXF, DWG or customer drawing via secure portal or email

02

CAD Conversion

Engineers convert & verify format, run DRC, confirm CD targets

03

Mask Writing

E-beam or laser direct-write on glass; wet etching for metal masks

04

CD Inspection

CD-SEM, defect scan, transmission measurement & data sheet issued

05

Ship Worldwide

Packed in mask shipping box, tracked delivery, typically 7–14 days total

Photomask Fabrication
Chrome-on-glass for every aligner

Our photomasks use a chromium layer deposited on optical-grade glass. The chrome is patterned by direct-write e-beam or laser writing for sub-micron feature fidelity. Supplied with pellicle frame option.

Compatible with all mask aligner formats (MA6, EVG, Karl Süss), KrF/i-line steppers, and contact/proximity exposures.

  • Soda-lime glass: Standard, 4"–7" sizes, contact lithography
  • Borosilicate (Borofloat): Low thermal expansion, 4"–9"
  • Fused silica / quartz: Flatness <0.5µm, UV/DUV grade
  • Anti-reflective (ARC) coating available on request
  • Binary or half-tone (HTM) attenuated phase-shift masks
  • Pellicle mounting option for cleanroom environments
  • Full inspection report with every mask shipment
GLASS SUBSTRATE (QUARTZ) CHROME LAYER (~80nm) PATTERNED CHROME CD pellicle 5" × 5" mask | 6.35mm thick
WET ETCH (PCM) tapered sidewall ~10%t LASER CUT sharp vertical walls ±10µm ELECTROFORMED Ni smoothest walls · 30µm min aperture SUS304/Ni/Mo SUS301/304 Ni · Hv370 THREE ROUTES, one coordinated process flow
Metal Mask Fabrication
Three routes, matched to your application

The optimal metal mask route depends on your feature size, required aperture wall quality, material, and volume. All three methods are available , you get a recommendation with your quote at no extra charge.

  • Wet etch (PCM): SUS304/SUS316/Ni/Mo/Cu, best cost-performance for prototypes and medium volumes where taper is acceptable
  • Laser cut: SUS301/304 HA/TA, sharpest edges, no photomask needed, fastest turnaround, up to 600×600mm
  • Electroformed Ni: smoothest possible aperture walls, down to 30µm opening, for fine-pitch BGA, micro-LED, OLED pixel deposition
  • Half-etch / step etch: thinner around fine-pitch areas, thicker elsewhere, different paste volumes on one print pass
  • Frame mounting: stretched and welded to aluminium or SUS frame for printer registration
  • Post-processing: mechanical polishing to remove aperture edge radius, prevents print bleeding
  • Evaporation & deposition masks: all three methods suitable, Mo preferred for high-temperature PVD applications
Deposition & Evaporation Mask Applications

Not just electronics, masks for semiconductor & MEMS fabrication

Your photolithography customers also need physical deposition masks, for patterning materials that cannot tolerate resist chemistry, high-temperature PVD, or large-area substrates where spinning resist is impractical.

💡
OLED Pixel Deposition
Fine-pitch Ni electroformed masks define RGB sub-pixel openings for thermal evaporation of OLED organic layers. 30µm minimum aperture, ultra-smooth walls for clean material boundaries.
Electroformed Ni · 30–100µm aperture · ±10µm
🔵
PVD / Sputtering Masks
Mo or SUS masks for selective area deposition during sputtering. High-temperature stable. Used for electrode patterning on glass, ceramic, and wafer substrates without photoresist.
Mo · SUS304 · up to 600×600mm · wet etch or laser
⚗️
E-Beam Evaporation Masks
Molybdenum masks for high-vacuum e-beam evaporation of metals (Au, Pt, Ti, Al) onto MEMS, optical, and sensor devices. Mo handles elevated substrate temperatures without warping.
Mo · 50–300µm · wet etch · high-temp stable
🔲
Solder Paste Stencil (PCB / Electronics)
Laser-cut SUS304 stencils for cream solder printing on PCBs and substrates. Standard ±10µm shape accuracy, 600×600mm max size. Aperture wall polishing option for improved paste release.
Laser cut · SUS304 · 30–200µm · 600×600mm
🧬
Organic Semiconductor Masks
Shadow masks for OFET, OPV, and organic sensor device fabrication. Pattern organic semiconductor layers without solvents that would attack underlying films. SUS or Ni, no post-etch contamination.
SUS304 / Ni · wet etch · 20–200µm
🎯
Ion Beam & Ion Implant Masks
Heavy stainless or Mo masks for selective area ion beam etching and implantation on wafers and substrates. The mask thickness determines shielding effectiveness at different ion energies.
Mo · SUS316 · 100–500µm · wet etch PCM
Next in your process flow

Photolithography: Transfer your mask pattern onto the wafer, E-beam 20nm, KrF 50nm, large-format 500×600mm, mask aligner front-to-back. Six exposure methods, .

Photolithography →

Submit your design.
Get a quote in 3 days.

Send us any format, GDS, DXF, DWG, customer drawing, or even a hand sketch. Our engineers review personally and respond with a technical quote within 3 business days.

[email protected] · +81-3-5288-5569 · NDA available on request
All Services
Full process flow →
Substrates
🔷 Substrate & WafersSi, SiC, GaN, glass, sapphire 🔬 Fused Silica WafersQuartz · borosilicate · low CTE 🟣 PI Film & SUS Sensor FabRoll-to-roll · sensor patterning
Front-End
🎭 Mask FabricationGDS to chrome mask, DRC 💡 PhotolithographyE-beam 20nm to 500×600mm 🔬 NanoimprintingUV & thermal NIL 🔵 Thin Film DepositionPVD, CVD, ALD, MBE ⬆️ LiftoffMetal pattern · shadow mask ⚡ ElectroplatingCu TSV fill, DPC, LIGA ⚗️ EtchingICP-RIE, DRIE >50:1 🌡️ AnnealingN₂/H₂/vacuum/RTA 🎯 Ion ImplantationB/P/As/Al/N implant 🔶 CMP & GrindingCu CMP, 50µm thinning ✂️ DicingBlade, stealth laser 🧪 Wafer CleaningRCA, plasma, megasonic
Advanced Packaging
🔗 Wafer BondingHybrid, eutectic, fusion 📌 TSV FabricationHigh AR, void-free Cu fill 🔓 TSV RevealBackgrind → etch → CMP 🪟 TGV FabricationThrough-glass via 📐 RDL FabricationBCB/PBO/PI + damascene 📦 Packaging & AssemblyWire bond, flip-chip 📚 3D/2.5D PackagingTSV+RDL+UBM+C4 🥇 AuSn BumpPVD lift-off, fluxless 🧬 Biochip & MicrofluidicsGlass 500×600mm, NIL 🔆 SiPho PackagingTSV·RDL·UBM·C4 for PIC
Industries
🤖 AI & HPC PackagingCoWoS-style, 2.5D/3D 💎 Silicon PhotonicsSOI · AuSn · TSV interposer 🚗 AutomotiveMEMS sensors, SiC power 🧬 Life SciencesLab-on-chip, biosensors 🔭 All Industries → Request a Quote →
Technical AI — Nanosystems JP Inc.
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Services & Industries
⚙️ Capabilities Overview
Substrates
🔷 Substrate & WafersSi, SiC, GaN, glass, sapphire 🔬 Fused Silica WafersQuartz · borosilicate · low CTE 🟣 PI Film & SUS Sensor FabRoll-to-roll · sensor patterning
Front-End
🎭 Mask FabricationGDS to chrome mask, DRC 📷 PhotolithographyE-beam 20 nm to 500×600 mm 🔬 NanoimprintingUV & thermal NIL 🫧 Thin Film DepositionPVD, CVD, ALD, MBE ⬆️ LiftoffMetal pattern · shadow mask ⚡ ElectroplatingCu TSV fill, DPC, LIGA 🌊 EtchingICP-RIE, DRIE >50:1 🔥 AnnealingN₂ / H₂ / vacuum / RTA ⚛️ Ion ImplantationB / P / As / Al / N implant 🔄 CMP & GrindingCu CMP, 50 µm thinning 💎 DicingBlade, stealth laser 🧪 Wafer CleaningRCA, plasma, megasonic
Advanced Packaging
🔗 Wafer BondingHybrid, eutectic, fusion 📌 TSV FabricationHigh AR, void-free Cu fill 👁️ TSV RevealBackgrind → etch → CMP 🪟 TGV FabricationThrough-glass via 🔀 RDL FabricationBCB / PBO / PI + damascene 📦 Packaging & AssemblyWire bond, flip-chip 📚 3D / 2.5D PackagingTSV + RDL + UBM + C4 🥇 AuSn BumpPVD lift-off, fluxless 🧬 Biochip & MicrofluidicsGlass 500×600 mm, NIL 🔆 SiPho PackagingTSV · RDL · UBM · C4 for PIC
Industries
🤖 AI & HPC PackagingCoWoS-style, 2.5D / 3D 💡 Silicon PhotonicsSOI · AuSn · TSV interposer 🚗 AutomotiveMEMS sensors, SiC power 🧬 Life SciencesLab-on-chip, biosensors 🔭 All Industries → Request a Quote →