Glass Interposer Prototyping
and TGV Test Coupons
Glass test vehicles built to the stage your work starts from: hole-only coupons, seeded or lined vias, filled vias, and routed interposer prototypes. Customer-supplied pre-drilled glass can be reviewed and metallized.
larger on request
minimum internal diameter
minimum internal diameter
or filled delivery
Start with the part of the flow you need
Use a coupon to isolate one process question, or combine agreed steps into an interposer prototype. Each delivery state is a distinct order.
Hole-only TGV coupons
Via diameter, pitch, profile, and substrate thickness reviewed together; arrays, isolated vias, and defined inspection fields; handling, edge quality, and cleanliness requirements scoped for your next process.
Metallized via coupons
Seeded, sidewall-lined (open center), or filled vias, with the plating contact, adhesion route, and inspection access considered from the start.
Routed glass prototypes
Front- and back-face routing on the metallized glass, with dielectric and pad finish defined; customer pre-drilled glass reviewed for incoming condition.
Glass Interposer Prototyping and TGV Test Coupons
Scope and specification options. Every figure is confirmed for your program in the quotation.
Glass, geometry, and metal work together
Share both the starting substrate and the finished cross-section. Process compatibility is reviewed across the whole sequence, not step by step.
| Parameter | What to include in your inquiry |
|---|---|
| Glass and format | Manufacturer and grade where known, composition or material data, wafer or coupon size, thickness, and total thickness variation if specified. |
| Via geometry | Entry, exit, and minimum internal diameter; substrate thickness, via pitch, array size, and shape (through, blind, tapered, hourglass). |
| Incoming condition | Unprocessed or pre-drilled glass, existing films, hole condition, cleaning history, and any surface treatment already applied. |
| Metallization endpoint | Seed-only, sidewall-lined, or filled; preferred adhesion and barrier layers, Cu thickness, and the finish required by your next step. |
| Routing and interfaces | Front- and back-face layouts, coordinate orientation, dielectric stack, line and space, pad finish, and alignment requirements. |
| Inspection and delivery | Quantity, destructive sampling allowance, dimensional and electrical criteria, and wafer or diced coupon format. |
One defined route from glass to coupon
The sequence below includes optional stages. Your quotation names the starting material, the steps included, and the final delivery condition.
- 01Review the test vehicleAgree the glass grade, via geometry, layout orientation, endpoint, and measurement plan.
- 02Form or receive viasProduce the hole pattern, or inspect customer-supplied pre-drilled glass for profile, cleanliness, and handling condition.
- 03Prepare and seedApply the agreed surface preparation and adhesion or seed route, with coverage through the via considered.
- 04Build the Cu structureForm the selected lining or fill condition, with plating contact and metal distribution defined.
- 05Finish and routeCu finishing, planarization, dielectric, and front- or back-face routing where included.
- 06Inspect and deliverDimensional, cross-section, and electrical checks as agreed, then wafer or diced coupon delivery.
Check the feature that matters to your trial
Plan the sampling sites and any sacrificial coupons before the run. Electrical checks need a suitable pad and routing layout.
Via geometry and glass condition
Entry and exit dimensions, via profile, and visible edge or surface defects at identified fields.
Metallization and coverage
Layer measurements and cross-sections to evaluate the selected lining or fill condition.
Surface and handling
Topography, residual metal, bow, and the surface condition required by your next process.
Electrical connections
Continuity, resistance, or isolation using the defined test layout and access pads.
Delivery: hole-only, seeded, lined, filled, or routed structures as quoted, on full substrates or as diced, identified evaluation coupons.
Glass test vehicles for materials and packaging teams
Glass and chemistry evaluation
Compare substrate grades, surface preparation, adhesion, and metallization on one defined via pattern.
Equipment and process trials
Repeatable coupons for drilling, seeding, plating, and planarization tool development.
Interposer architecture studies
Small routed prototypes to test pitch, routing density, and stack-up before committing to a full build.
Define the glass flow before fabrication
Can I order only the glass with holes?
Yes. Hole-only coupons are a distinct delivery option. Include the glass grade, thickness, via pattern, entry and exit dimensions, cleanliness needs, and any requirement from your next process.
Can you metallize glass that has already been drilled?
Customer-supplied pre-drilled glass can be reviewed. Composition, hole profile, minimum internal diameter, surface condition, and handling format determine the suitable route.
What is the difference between a lined and a filled via?
A lined via has metal along the sidewall with an open center; a filled via has a metal-filled core. They differ in fabrication, surface finishing, and integration, so state the intended condition.
Can the prototype include routing on both sides?
Double-face routing is reviewed together with the via and dielectric stack. Provide front- and back-face layouts, orientation conventions, pad finishes, alignment requirements, and test access.
How is via-fill quality verified?
The quotation defines the inspection method, sample count, locations, and acceptance criteria. Cross-sections characterize sampled vias; other methods depend on the glass and metal geometry.
Does an interposer prototype include the full package substrate?
The delivered stack is defined in the quotation. Build-up layers, bumps, die attach, and assembly can be added as further steps with their own requirements.
Processes usually combined with this work
Start your project.
Response typically within one business day.
Share your process requirements, substrate, and production volume. A Nanosystems JP Inc. engineer will respond typically within one business day. Full quote typically within 7-10 business days, subject to project complexity and NDA requirements.