Laser Submounts
and Silicon Optical Benches
Si and AlN submounts, silicon optical benches with V-grooves and recesses, patterned metallization, and AuSn-ready pads. Ordered bare, metallized, or solder-coated, with the mechanical and metal drawings reviewed together.
per thermal design
reviewed per diameter
solder options
condition you need
The physical platform for your optical design
Order a standalone component, or discuss selected assembly steps. Mechanical reference surfaces and metal interfaces are reviewed alongside your device drawing.
Laser and photonic submounts
Die-attach pads and electrical connection areas, front- and back-face metal reviewed together, with thermal path, electrical isolation, and assembly constraints considered.
Silicon optical benches
V-grooves for fiber placement subject to geometry and crystal orientation; recesses, steps, cavities, and alignment marks; wet-etch or DRIE routes selected for the feature shape.
Metallized and solder-ready parts
Au-finished pads and selected AuSn layer or bump options, with pad geometry reviewed against the die backside metal and the attachment method.
Laser Submounts and Silicon Optical Benches
Scope and specification options. Every figure is confirmed for your program in the quotation.
Bring the mechanical and metal drawings together
A useful inquiry describes the finished component and the parts that will mount to it. The fabrication route is reviewed against those interfaces.
| Parameter | What to include in your inquiry |
|---|---|
| Material and part format | Si or AlN, grade or orientation where relevant, part dimensions, thickness, surface finish, and quantity. |
| Mechanical features | Dimensioned drawing for grooves, cavities, steps, mounting areas, through-features, and dicing lines. |
| Optical reference geometry | Fiber diameter and pitch, intended groove engagement, die mounting height, and optical-axis offsets with their datums. |
| Metallization and solder | Pad layout, adhesion and barrier preferences, metal thicknesses, backside metal, insulation, and solder requirement. |
| Assembly conditions | Mating die material and backside stack, attachment method, permitted process temperature, and handling limits. |
| Delivery and acceptance | Bare etched, metallized, solder-coated, or assembled condition; dimensional and film inspection requirements. |
From the component drawing to your assembly line
The sequence is selected for the substrate and the required delivery condition. Silicon etching and AlN component processing use different routes.
- 01Review the interfacesMounting planes, grooves, optical references, pad positions, mating materials, and the assembly that follows.
- 02Prepare the substrateSelect or receive the material and confirm thickness, orientation, surface condition, and handling.
- 03Form the featuresProduce the agreed mechanical features; for silicon, anisotropic wet etching or DRIE according to the shape required.
- 04Pattern the metalForm the specified insulation and adhesion, barrier, and surface-metal sequence, including solder layers where required.
- 05Singulate and finishDice or otherwise finish the parts, with edge quality and protected surfaces considered.
- 06Inspect and deliverCheck the defined dimensions and film features, then package components or proceed to separately agreed assembly.
Verify the interfaces before mounting the die
Inspection is tied to the component drawing. State which dimensions and surfaces control your next assembly step.
Mechanical geometry
Groove, recess, step-height, thickness, and outline measurements relative to the specified datums.
Metal pattern and stack
Pad placement, pattern dimensions, and agreed film-thickness measurements; further stack checks on request.
Surface and edge condition
Visual checks for exposed surfaces, singulation edges, contamination, and handling-sensitive features.
Assembly evaluation
Where assembly is included, the inspection method and any optical, thermal, or electrical evaluation are defined in advance.
Delivery: bare structured silicon benches or prepared submounts, metallized or AuSn-coated components as quoted, identified parts with the agreed dimensional and film data, and optional die-attach or packaging work reviewed with your components.
Custom components for photonics development
Laser and emitter modules
Submounts and attachment interfaces for customer laser dies, emitters, and package components.
Fiber and PIC assemblies
Benches that hold fiber and photonic chips in a defined mechanical relationship.
Sensing and research optics
Small quantities of custom platforms for instruments and laboratory systems.
Before you finalize the drawing
How do I choose between silicon and AlN?
Start with the thermal path, electrical isolation, feature geometry, expansion requirements, and metallization needs. Silicon suits lithographically defined mechanical features; AlN suits high thermal conductivity with electrical isolation.
Can you make V-grooves for my fiber diameter?
A silicon V-groove is reviewed from the fiber diameter, pitch, target center height, and required contact geometry. Crystal orientation and the wet-etch route constrain the groove angle.
Can the part include AuSn for die attachment?
Selected AuSn layers or bump structures are reviewed with the pad stack and the die backside metal. Solder amount, barrier layers, wettable area, and the intended bonding profile are defined together.
Can I supply my own submounts for metallization?
Customer-supplied Si or AlN parts can be reviewed. Provide dimensions, material details, surface finish, existing films, cleanliness history, and available handling area.
Does a finished bench guarantee optical alignment?
The component is inspected against the agreed mechanical drawing. Final alignment and coupling depend on the fiber, active die, attachment layers, fixtures, and assembly method.
Can I buy only the passive components?
Yes. Bare structures, metallized parts, and solder-coated components are scoped as standalone deliverables; active dies, fibers, attachment, and packaging only where separately agreed.
Processes usually combined with this work
Start your project.
Response typically within one business day.
Share your process requirements, substrate, and production volume. A Nanosystems JP Inc. engineer will respond typically within one business day. Full quote typically within 7-10 business days, subject to project complexity and NDA requirements.