Optical Access Components
Windows, Apertures & Meshes
At Nanosystems JP Inc., we fabricate the small optical parts quantum and sensing hardware cannot buy off the shelf: double-side patterned windows, Ti/Au films, metal apertures, and fine meshes on sapphire and fused silica, through-glass holes by unfilled TGV, and Si-glass bonded cell bodies. Representative delivered work: Ti/Au patterned fused silica windows and an aluminum mesh on sapphire with 1.3 µm-class openings. This page highlights capabilities that have already been delivered. From single pieces and single wafers, managed end to end by a dedicated project manager.
shipped on sapphire
front to back
fused silica
experiment-friendly
Bridging optical fabrication and semiconductor patterning.
A patterned window falls between two industries: optics houses supply beautiful blanks but no lithography, and most fabs will not touch a 0.5 mm fused silica disc. Our fused silica wafer program plus full lithography closes the gap, one order, one drawing, one part number.
Micron patterns on
optical-grade transparent parts
Three capabilities define the service, and each one has already left the building on a customer's part.
Patterned Windows, Both Sides
Ti/Au electrodes, contact pads, alignment fiducials, and opaque field masks patterned directly on fused silica and sapphire windows, on one face or both, aligned front to back. We have shipped Ti/Au on fused silica; polishing, thickness tolerance to ±10 µm, and TTV below 5 µm on precision grades come through the fused silica wafer program the windows are cut from.
Apertures & Fine Meshes
Metal apertures, beam-defining stops, and periodic meshes by lift-off on transparent substrates, down to aluminum meshes with 1.3 µm-class openings we delivered on sapphire. Hole size, pitch, and fill factor per your optical design, in Al, Ti/Au, or other evaporable metals, with the pattern placed to your fiducials.
Holes, Cavities & Bonded Bodies
Through-glass holes by unfilled TGV for beam access and fill ports, DRIE cavities in silicon, and Si-glass stacks joined by anodic, adhesive, or eutectic bonding, the building blocks of cells, chambers, and windowed housings. Coatings, including the SiO₂/TiO₂ AR stacks of our photonics flow, are coordinated per program.
A patterned window,
annotated
One drawing of the part this page sells: electrodes on top, aperture on the back, a through-glass hole, and a 1.3 µm-class mesh in the inset.
Complete optical access
parameters
| Parameter | Specification |
|---|---|
| Substrates | Fused silica, sapphire, borosilicate glass, Si for bodies; others on request |
| Formats | Wafers 4 to 8 inch; chip-scale rectangles and discs per drawing |
| Metals | Ti/Au, Al, Cr, and other evaporable systems; lift-off patterned |
| Feature Sizes | Mesh holes from ~1 µm class (1.3 µm shipped); apertures and pads per design |
| Sides | Single or double, front-to-back aligned |
| Thickness / Flatness | ±10 µm thickness tolerance; <5 µm TTV on precision-grade fused silica |
| Through-Holes | Unfilled TGV in glass / fused silica, Ø20 µm class standard; Cu fill optional |
| Bonding | Anodic, adhesive, eutectic Si-glass stacks; open halves or bonded bodies |
| Coatings | AR (SiO₂/TiO₂ class) and functional coatings coordinated per program |
| Deliverable | Finished parts: patterned, cut, inspected, optics-packed |
| Minimum Lot | From 1 piece or 1 wafer; repeat lots on the same recipe |
Optical access across quantum
and precision sensing
Vapor & Vacuum Cell Windows
Patterned windows and bonded bodies for alkali vapor cells and miniature vacuum chambers, electrode-carrying glass where the physics wants field plates right at the volume.
Trap & Beam Optics
Apertures, beam stops, and through-holes that define and admit laser paths in ion and atom hardware, positioned to the same fiducials as the electrical pattern.
Field Meshes & Grids
Fine conductive meshes on transparent substrates where a field or shield must coexist with a view, the shipped 1.3 µm sapphire mesh being exactly this part.
Spectroscopy & Analytics
Windowed flow cells, patterned reference apertures, and chambered optics for instruments, drawing on the same Si-glass bonding as the microfluidics service.
Compact & Fieldable Sensors
Miniaturized optical assemblies for OPMs, clocks, and deployable sensors, where every part must be batch-fabricated, not hand-made, to reach volume.
One-Off Experiment Parts
Single windows, single meshes, single bonded chambers from a sketch and a phone call, the parts that otherwise hold up a research program for months.
What makes our optical access capability
different
Shipped, not speculative
Ti/Au fused silica windows and the 1.3 µm sapphire mesh are delivered parts. These examples illustrate parts delivered through this service.
Optics and lithography, one order
Substrate, polish grade, pattern, holes, bond, and dicing on one part number, closing the gap between optics houses and fabs.
Double-side as a discipline
Front-to-back alignment is routine here, so electrode-and-aperture pairs land where the optical design put them.
Transparent substrates are standard work
Fused silica, sapphire, and glass are routine substrates for this service, handled, cleaned, and packed to optics expectations.
Integrate the related fabrication steps
TGV holes, seal rings, vapor-cell bodies, and cryo metallization live on adjacent pages, one program covers the whole assembly.
From 1 piece, honestly
Single parts are quoted and built without a production-order lecture, and repeat lots inherit the exact recipe.
Start your project.
Initial response typically within one business day.
Share your process requirements, substrate, and production volume. A Nanosystems JP Inc. engineer will give an initial response typically within one business day. Full quote typically within 7-10 business days, subject to project complexity and NDA requirements.