Quantum Offerings, MEMS Vapor Cells

MEMS Vapor Cells
Wafer-Level Alkali Cell Bodies

At Nanosystems JP Inc., we fabricate the silicon-and-glass bodies of MEMS alkali vapor cells: DRIE cavities etched in silicon, anodic or adhesive bonding to glass windows, patterned apertures and electrodes where the design calls for them, delivered as open halves or bonded, unfilled cell bodies with fill ports and getter features per your layout. Alkali filling and final sealing stay at your line or are arranged per program. This is the flow behind OPM magnetometers and chip-scale atomic clocks, the quantum segment closest to real volume, and our microfluidics and bonding lines already run every step of it. From a single wafer pair.

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DRIE cavity bodies Anodic & adhesive bonding Open halves or bonded bodies Unfilled, fill ports per design Getter features per layout OPM & chip-scale clocks Wafer-level batches From 1 wafer pair
50:1
DRIE aspect ratio for
cavity walls and ports
2
Windows per cell -
double-side bonded stacks
100s
Cells per wafer pair -
batch economics built in
1
Wafer-pair minimum -
prototype to volume path
An Honest Division of Labor

We build the bodies; the alkali stays your call

Alkali filling and final hermetic sealing are the physics-team steps, tied to your species, buffer gas, and sealing method. What stalls those teams is everything before: hundreds of identical, clean, well-bonded cavities. That is wafer fabrication, and it is what this page sells. Filling and getter material integration can be arranged per program; the windows and apertures come from next door.

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Why It Works
A vapor cell is a MEMS part
wearing physics clothing

Strip the atomic physics away and a MEMS vapor cell is a bonded cavity with optical windows, exactly the structure our microfluidics and bonding lines produce every week.

🕳

Cavities Are Etching

Cell volumes, connecting channels, fill ports, and reservoir pockets are DRIE geometry: vertical walls at up to 50:1 aspect ratio, dimensions set by lithography, hundreds of identical cavities per wafer. Wet KOH profiles are available where sloped walls serve the optical path, and every cavity lands within lithographic tolerance of its neighbors.

DRIE to 50:1 KOH profiles optional Channels & fill ports 100s of cells per wafer
🥪

Cells Are Bonding

Glass window to silicon body to glass window: the canonical cell is two bonds, and both live on our bonding service. Anodic bonding for the classic borosilicate-to-Si hermetic joint, adhesive bonding where temperature or stack demands it, eutectic frames where a metal seal is specified, with wafer pairs aligned so every cell's windows and cavity agree.

Anodic: the classic Adhesive & eutectic options Double-side stacks Wafer-aligned windows
🧲

Function Is Patterning

Heaters, field electrodes, apertures, and opaque masks pattern onto the windows before bonding, through the optical access flow, and getter pockets, fill channels, and breakable seals appear in the silicon per your layout. The body arrives with its functions built in, so what remains at your line is the physics: fill, seal, characterize.

Heaters & electrodes on glass Getter pockets per layout Fill channels & ports Physics steps stay yours
Cell Sketch
Anatomy of a cell body

The exploded stack, the bonded unfilled body it becomes, and the four formats a program can order it in.

Window · heater / electrodesSi bodyDRIE cavitygetter pocketfill channelWindowBonded unfilled body→ fill port openAnodic / adhesive bond linesF1 Etched wafersF2 Open halvesF3 Bonded unfilled · flagshipF4 Diced cellsAlkali filling and final seal: your line / arranged per program
Cell body anatomy and the four deliverable formats
Deliverable Formats
Open halves, bonded bodies,
and the steps between

Programs enter this flow at different points. All four formats below are standard deliverables, on the same recipe, so moving from one to the next is a purchase order, not a redesign.

Format options
The vapor cell body menu
Cavity dimensions, port layouts, and window patterns follow your drawing; formats differ only in how far down the flow we take them.
F1
ETCHED BODY WAFERS
Si cavities, unbonded
DRIE cavity wafers alone, for teams running their own bonding: cavities, channels, and ports etched, cleaned, and ready for your glass.
F2
OPEN HALVES
One bond done, one open
Body bonded to the first window, second face open for your filling method, the format load-lock and pipette-fill teams ask for.
F3
BONDED UNFILLED BODIES
Both bonds done, fill ports open
The full sandwich, sealed except for your fill ports and channels, ready for backfill and final closure at your line. The flagship format.
F4
DICED CELLS & ARRAYS
Singulated to outline
Any format above diced to single cells or small arrays, edges and windows protected, packed for optics handling.
Delivered unfilled; alkali filling and final sealing at your line or arranged per program
Getter pockets, reservoirs, and fill features fabricated per your layout; getter material integration by arrangement
Window patterning (heaters, electrodes, apertures, masks) via the optical access flow
Borosilicate standard; fused silica and sapphire windows per program
Anodic, adhesive, and eutectic bonding per stack and temperature budget
Bond and cavity inspection standard; cross-section and leak-check coordination on request
Microfluidics-line heritage: bonded cavity devices are routine here
From 1 wafer pair; the same recipe scales to volume batches
Process Specifications
Complete vapor cell body
parameters
ParameterSpecification
Body MaterialSilicon, DRIE-etched; KOH profiles optional
WindowsBorosilicate standard; fused silica, sapphire per program
Cavity GeometryPer drawing; DRIE to 50:1 aspect ratio; channels, ports, reservoirs
Wafer Sizes4 inch (100mm), 6 inch (150mm), 8 inch (200mm)
BondingAnodic, adhesive, eutectic; single- or double-side stacks
Window FunctionsHeaters, electrodes, apertures, opaque masks; patterned before bond
Fill ProvisionsFill ports, channels, getter pockets per layout; delivered unfilled
Filling & SealingAt your line, or arranged per program
FormatsEtched wafers, open halves, bonded unfilled bodies, diced cells
InspectionCavity metrology and bond inspection standard; more on request
Minimum LotFrom 1 wafer pair; same recipe to volume batches
Applications
The cell-shaped corner
of quantum sensing
🧲

OPM Magnetometers

Cell bodies for optically pumped magnetometers, biomagnetic imaging to geophysics, where per-channel cell count makes wafer-level batch fabrication the only economics that work.

OPM arrays · MEG-class sensing · Batch economics

Chip-Scale Atomic Clocks

The original MEMS cell application: miniature cavities with buffer-gas-ready volumes and heater-patterned windows, on the flow CSAC programs standardized.

CSAC · Heater windows · Established flow
🌀

Gyroscopes & NMR Cells

Nuclear-spin gyroscope and NMR-based sensor cells, where cavity symmetry and wall quality come straight from lithography rather than glassblowing.

NMR gyros · Lithographic symmetry · No glassblowing
📡

Rydberg & RF Sensing

Vapor cells for Rydberg-atom electrometry and RF sensing, with electrode-patterned windows placing fields exactly where the atoms are.

Rydberg sensing · Electrode windows · Field at the atoms
🔬

Spectroscopy References

Miniature reference cells for laser stabilization and spectroscopy, batch-consistent so every instrument in a product line sees the same cell.

Laser locking · Reference cells · Batch consistency
📚

Research Cell Programs

Single wafer pairs for cell development: cavity splits, port variants, and window options across one wafer, so a semester of glasswork becomes one fab run.

From 1 pair · Design splits · One run, many variants
Why Nanosystems JP Inc.
What makes our vapor cell capability
different
01

The unglamorous part, mastered

Hundreds of clean, identical, well-bonded cavities is a fab problem, and it is the problem our microfluidics line solves routinely.

02

Honest scope

Bodies, unfilled. Your species, your buffer gas, your sealing physics stay yours, with filling arranged per program when wanted.

03

Four formats, one recipe

Etched wafers to diced cells on the same masks, so a program can enter anywhere and scale without redesign.

04

Windows with functions

Heaters, electrodes, and apertures arrive already on the glass, through the optical access flow next door.

05

Nearest-to-volume thinking

This segment ships real products, so the flow is built for repeat batches on fixed recipes, not just hero wafers.

06

One program, one manager

Etch, bond, pattern, and dice under one thread, managed end to end by a dedicated project manager.

Related service

Bonding: The anodic, adhesive, and eutectic wafer bonding behind every cell body runs as its own service, with trials and full pair processing.

Bonding →

Start your project.
Response within 24 hours.

Share your process requirements, substrate, and production volume. A Nanosystems JP Inc. engineer will respond within 24 hours. Full quote typically within 7-10 business days, subject to project complexity and NDA requirements.

To speed up technical review, please include:
substrate type & size  ·  target process  ·  quantity  ·  timeline  ·  design files if available (not required for first review)
Not ready to share details? Request NDA first →

[email protected] · +81-3-5288-5569 · NDA available on request

Ready to discuss this process?
Technical review within 24 hours of inquiry. NDA available.
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All Services
Full process flow →
Substrates
🔷 Substrate & WafersSi, SiC, GaN, glass, sapphire 🔬 Fused Silica WafersQuartz · borosilicate · low CTE 🟣 PI Film & SUS Sensor FabRoll-to-roll · sensor patterning
Front-End
🎭 Mask FabricationGDS to chrome mask, DRC 💡 PhotolithographyE-beam 20nm to 500×600mm 🔬 NanoimprintingUV & thermal NIL 🔵 Thin Film DepositionPVD, CVD, ALD, MBE ⬆️ LiftoffMetal pattern · shadow mask ⚡ ElectroplatingCu TSV fill, DPC, LIGA ⚗️ EtchingICP-RIE, DRIE >50:1 🌡️ AnnealingN₂/H₂/vacuum/RTA 🎯 Ion ImplantationB/P/As/Al/N implant 🔶 CMP & GrindingCu CMP, 50µm thinning ✂️ DicingBlade, stealth laser 🧪 Wafer CleaningRCA, plasma, megasonic
Advanced Packaging
🔗 Wafer BondingHybrid, eutectic, fusion 📌 TSV FabricationHigh AR, void-free Cu fill 🔓 TSV RevealBackgrind → etch → CMP 🪟 TGV FabricationThrough-glass via 📐 RDL FabricationBCB/PBO/PI + damascene 📦 Packaging & AssemblyWire bond, flip-chip 📚 3D/2.5D PackagingTSV+RDL+UBM+C4 🥇 AuSn BumpPVD lift-off, fluxless 🥈 Indium BumpEvap lift-off · cryo/quantum 🧱 UBM DepositionTi/Pt/Au · adhesion-barrier-Au 🪙 Gold BumpEvap & plated · Au-Au TC 🔥 AuGe / AuSi356/363°C eutectic die attach 🛰️ High-Pb Bumps95Pb5Sn · hi-rel C4 ⚗️ SLID / TLPCu/Sn · Au/In · Ag/In 🔒 Al-Ge Sealing424°C · CMOS-friendly MEMS ⚡ Ohmic ContactsGaAs · GaN · RTA + TLM 🧊 Cryo & UHV MetallizationAuSn · Ti/Pd/Au · seal rings 🪟 Optical AccessWindows · meshes · thru-holes 🫙 MEMS Vapor CellsDRIE + bond · unfilled bodies 💠 Thin-Film-on-InsulatorQuartz-on-Si · LNOI 🧬 Biochip & MicrofluidicsGlass 500×600mm, NIL 🔆 SiPho PackagingTSV·RDL·UBM·C4 for PIC
Industries
🤖 AI & HPC PackagingCoWoS-style, 2.5D/3D 💎 Silicon PhotonicsSOI · AuSn · TSV interposer ⚛️ Quantum TechnologyIon traps · vapor cells · TFOI 🚗 AutomotiveMEMS sensors, SiC power 🧬 Life SciencesLab-on-chip, biosensors 🔭 All Industries → Request a Quote →
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⚙️ Capabilities Overview
Substrates
🔷 Substrate & WafersSi, SiC, GaN, glass, sapphire 🔬 Fused Silica WafersQuartz · borosilicate · low CTE 🟣 PI Film & SUS Sensor FabRoll-to-roll · sensor patterning
Front-End
🎭 Mask FabricationGDS to chrome mask, DRC 📷 PhotolithographyE-beam 20 nm to 500×600 mm 🔬 NanoimprintingUV & thermal NIL 🫧 Thin Film DepositionPVD, CVD, ALD, MBE 🖥 TFT & BackplaneIGZO · Glass · Display ⬆️ LiftoffMetal pattern · shadow mask ⚡ ElectroplatingCu TSV fill, DPC, LIGA 🌊 EtchingICP-RIE, DRIE >50:1 🔥 AnnealingN₂ / H₂ / vacuum / RTA ⚛️ Ion ImplantationB / P / As / Al / N implant 🔄 CMP & GrindingCu CMP, 50 µm thinning 💎 DicingBlade, stealth laser 🧪 Wafer CleaningRCA, plasma, megasonic
Advanced Packaging
🔗 Wafer BondingHybrid, eutectic, fusion 📌 TSV FabricationHigh AR, void-free Cu fill 👁️ TSV RevealBackgrind → etch → CMP 🪟 TGV FabricationThrough-glass via 🔀 RDL FabricationBCB / PBO / PI + damascene 📦 Packaging & AssemblyWire bond, flip-chip 📚 3D / 2.5D PackagingTSV + RDL + UBM + C4 🥇 AuSn BumpPVD lift-off, fluxless 🥈 Indium BumpEvap lift-off · cryo/quantum 🧱 UBM DepositionTi/Pt/Au · adhesion-barrier-Au 🪙 Gold BumpEvap & plated · Au-Au TC 🔥 AuGe / AuSi356/363°C eutectic die attach 🛰️ High-Pb Bumps95Pb5Sn · hi-rel C4 ⚗️ SLID / TLPCu/Sn · Au/In · Ag/In 🔒 Al-Ge Sealing424°C · CMOS-friendly MEMS ⚡ Ohmic ContactsGaAs · GaN · RTA + TLM 🧊 Cryo / UHV MetalAuSn · Ti/Pd/Au · rings 🪟 Optical AccessWindows · meshes · holes 🫙 Vapor CellsDRIE + bond · unfilled 💠 TFOI WafersQuartz-on-Si · LNOI 🧬 Biochip & MicrofluidicsGlass 500×600 mm, NIL 🔆 SiPho PackagingTSV · RDL · UBM · C4 for PIC
Industries
🤖 AI & HPC PackagingCoWoS-style, 2.5D / 3D 💡 Silicon PhotonicsSOI · AuSn · TSV interposer 🚗 AutomotiveMEMS sensors, SiC power 🧬 Life SciencesLab-on-chip, biosensors 🔭 All Industries → Request a Quote →