Electroplating

Electroforming
and LIGA Microstructures

Metal parts grown in a lithographic mold: nickel and copper structures with vertical sidewalls, tens to hundreds of micrometres tall, released as free-standing parts or left on the wafer. UV-LIGA on thick resist, nickel shims and stampers for nanoimprint and micro-molding, precision meshes and apertures.

Electroplating services →

Ni, Cu, Ni-CoUV-LIGAShims and stampersMeshes and aperturesVertical sidewallsFrom 1 wafer
10-500 µm
Structure height
typical
~10:1
Aspect ratio
typical
Ni / Cu
Electroformed
metals
1
Wafer minimum
order
What we make

Parts that machining cannot reach

Thick resist moldElectroformed NiReleased part

Schematic; aspect ratio and height are confirmed per design.

🔬

Nickel shims and stampers

Electroformed from a patterned master for nanoimprint, hot embossing and micro-molding; backside flattened and trimmed to your tool size. See nanoimprinting.

⚙️

Meshes, grids and apertures

Free-standing nickel meshes with micrometre bars and precise open area, apertures and slit arrays, for detectors, filters and shadow masks. See mask fabrication.

🧪

LIGA microstructures

Gears, springs, probes and fluidic parts with vertical walls from thick-resist molds; heights to hundreds of micrometres.

📐

On-wafer structures

Thick metal features left on the substrate: coils, heaters, posts and mechanical stops for MEMS and packaging.

🧩

Alloys

Ni-Co and Ni-Fe where hardness or magnetic response matters; Cu where conductivity does.

🔩

Finishing

Lapping, polishing, gold flash and dicing or laser trimming to the final part.

At a glance

Electroforming and LIGA Microstructures

Scope and specification options. Every figure is confirmed for your program in the quotation.

10-500 µm
Structure height typical
~10:1
Aspect ratio typical
Ni / Cu
Electroformed metals
1
Wafer minimum order
Ni, Cu, Ni-Co
UV-LIGA
Shims and stampers
Meshes and apertures
Vertical sidewalls
From 1 wafer
Capability

Typical ranges

ParameterTypicalNote
MetalsNi, Cu, Ni-Co, Ni-FeComposition per requirement
Height10-500 µmTaller by multi-layer molds on inquiry
Aspect ratio~10:1 UV-LIGAHigher with dedicated process
Minimum featureFrom ~2 µm at low height; scales with heightReviewed on the layout
SidewallNear vertical; draft controlled by resist processMeasured on cross section
Stress and flatnessBath chemistry and current set for low stress; flatness reported for shimsPer part specification
Formats100-200 mm wafers, platesPart release and handling agreed
What to send

For an electroforming quotation

ItemWhat helps
Part drawingGDS or dimensioned drawing with heights and tolerances
MetalNi, Cu or alloy, hardness or magnetic requirement
DeliveryFree-standing parts, on-wafer, or shim trimmed to a tool size
SurfaceRoughness, flatness and finish on each face
QuantityParts or wafers and target date
Related processes

Processes usually combined with this work

ElectroplatingPhotolithographyNanoimprintingMask FabricationMEMS Foundry
Related service

Electroplating: the process most often combined with this work, run in the same program.

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Direct answers

Questions engineers ask before ordering

What is the tallest structure?

10 to 500 µm typical by UV-LIGA; taller with multi-layer molds on inquiry.

Do you make nickel shims for nanoimprint?

Yes, electroformed from a patterned master, backside flattened and trimmed to your tool size.

Which metals?

Ni, Cu, Ni-Co and Ni-Fe, with composition set per requirement.

Start your project.
Initial response within one business day.

Share your process requirements, substrate, and production volume. A Nanosystems JP Inc. engineer gives an initial response, typically within one business day. A written quotation typically follows within 7-10 business days after we receive the required information and complete any prerequisite NDA.

To speed up technical review, please include:
substrate type & size  ·  target process  ·  quantity  ·  timeline  ·  design files if available (not required for first review)

sales@nanosystemsjp.co.jp · +81-3-5288-5569 · NDA available · All inquiries handled confidentially

Ready to discuss this process?
Initial engineering response typically within one business day. NDA available on request.
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All Services
Full process flow →
Substrates
Substrate & WafersSi, SiC, GaN, glass, sapphire Fused Silica WafersQuartz · borosilicate · low CTE PI Film & SUS Sensor FabRoll-to-roll · sensor patterning
Front-End
Mask FabricationGDS to chrome mask, DRC PhotolithographyE-beam 20nm to 500×600mm NanoimprintingUV & thermal NIL Thin Film DepositionPVD, CVD, ALD, MBE LiftoffMetal pattern · shadow mask ElectroplatingCu TSV fill, DPC, LIGA EtchingICP-RIE, DRIE >50:1 AnnealingN₂/H₂/vacuum/RTA Ion ImplantationB/P/As/Al/N implant CMP & GrindingCu CMP, 50µm thinning DicingBlade, stealth laser Wafer CleaningRCA, plasma, megasonic
Advanced Packaging
Wafer BondingHybrid, eutectic, fusion TSV FabricationHigh AR, void-free Cu fill TSV RevealBackgrind → etch → CMP TGV FabricationThrough-glass via RDL FabricationBCB/PBO/PI + damascene Packaging & AssemblyWire bond, flip-chip 📚 3D/2.5D PackagingTSV+RDL+UBM+C4 AuSn BumpPVD lift-off, fluxless Indium BumpEvap lift-off · cryo/quantum UBM DepositionTi/Pt/Au · adhesion-barrier-Au Gold BumpEvap & plated · Au-Au TC AuGe / AuSi356/363°C eutectic die attach High-Pb Bumps95Pb5Sn · hi-rel C4 SLID / TLPCu/Sn · Au/In · Ag/In Al-Ge Sealing424°C · CMOS-friendly MEMS Ohmic ContactsGaAs · GaN · RTA + TLM Cryo & UHV MetallizationAuSn · Ti/Pd/Au · seal rings Optical AccessWindows · meshes · thru-holes MEMS Vapor CellsDRIE + bond · unfilled bodies Thin-Film-on-InsulatorQuartz-on-Si · LNOI Biochip & MicrofluidicsGlass 500×600mm, NIL SiPho PackagingTSV·RDL·UBM·C4 for PIC
Industries
AI & HPC PackagingCoWoS-style, 2.5D/3D Silicon PhotonicsSOI · AuSn · TSV interposer Quantum TechnologyIon traps · vapor cells · TFOI AutomotiveMEMS sensors, SiC power Life SciencesLab-on-chip, biosensors All Industries → Request a Quote →
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Capabilities Overview
Substrates
Substrate & WafersSi, SiC, GaN, glass, sapphire Fused Silica WafersQuartz · borosilicate · low CTE Glass ProcessingDrilling, etching, polishing PI Film & SUS Sensor FabRoll-to-roll · sensor patterning
Front-End
Mask FabricationGDS to chrome mask, DRC PhotolithographyE-beam 20 nm to 500×600 mm NanoimprintingUV & thermal NIL Thin Film DepositionPVD, CVD, ALD, MBE ALD CoatingConformal oxides, nitrides PECVD DielectricsSiO₂, SiN, SiON, a-Si TFT & BackplaneIGZO · Glass · Display LiftoffMetal pattern · shadow mask ElectroplatingCu TSV fill, DPC, LIGA Electroforming & LIGANi shims, meshes, microstructures EtchingICP-RIE, DRIE >50:1 MEMS FoundrySensors, actuators, microfluidics Microchannel CoolingEtched, bonded, heater test chips Thermal Test ChipsHeater dies, multi-zone, RTD Temperature SensorsPt/NiCr RTDs, thermocouples AnnealingN₂ / H₂ / vacuum / RTA Ion ImplantationB / P / As / Al / N implant CMP & GrindingCu CMP, 50 µm thinning Wafer ThinningTo 50 µm on carriers Patterned Test WafersCustom CMP and process evaluation wafers Daisy-Chain Test DiesDummy dies, chains, bump options DicingBlade, stealth laser Wafer CleaningRCA, plasma, megasonic
Advanced Packaging
Wafer BondingHybrid, eutectic, fusion Anodic BondingGlass to silicon, cavities MEMS Cap WafersCavities, ports, seal lands, bonded TSV FabricationHigh AR, void-free Cu fill InterposersSi and glass, TSV/TGV + RDL TSV RevealBackgrind → etch → CMP TGV FabricationThrough-glass via Glass TGV CouponsHole-only to routed prototypes RDL FabricationBCB / PBO / PI + damascene Packaging & AssemblyWire bond, flip-chip 3D / 2.5D PackagingTSV + RDL + UBM + C4 AuSn BumpPVD lift-off, fluxless Laser SubmountsSi/AlN submounts, optical benches Indium BumpEvap lift-off · cryo/quantum UBM DepositionTi/Pt/Au · adhesion-barrier-Au Cu Pillar & SnAg BumpingPillars with SnAg caps, SnAg bumps Gold BumpEvap & plated · Au-Au TC AuGe / AuSi356/363°C eutectic die attach High-Pb Bumps95Pb5Sn · hi-rel C4 SLID / TLPCu/Sn · Au/In · Ag/In Al-Ge Sealing424°C · CMOS-friendly MEMS Ohmic ContactsGaAs · GaN · RTA + TLM SiC ProcessingContacts, implant, 1800 °C anneal GaN & III-VGaN, GaAs, InP processing Cryo / UHV MetalAuSn · Ti/Pd/Au · rings Optical AccessWindows · meshes · holes Vapor CellsDRIE + bond · unfilled TFOI WafersQuartz-on-Si · LNOI Biochip & MicrofluidicsGlass 500×600 mm, NIL SiPho PackagingTSV · RDL · UBM · C4 for PIC
Industries
AI & HPC PackagingCoWoS-style, 2.5D / 3D Silicon PhotonicsSOI · AuSn · TSV interposer AutomotiveMEMS sensors, SiC power Life SciencesLab-on-chip, biosensors All Industries → Request a Quote →