Silicon and Glass
Interposer Prototyping
Through-via interposers for 2.5D integration, photonics and sensor read-out: TSV or TGV, redistribution on one or both faces, UBM and bumps, delivered as wafers or diced parts. Send your GDS and get a manufacturability review before anyone commits to a lot.
materials
from
per face
formats
One program from via to bump
An interposer is a sequence of processes that each have their own page here. This page is where they are put together.
Schematic cross section. Via pitch, routing layers and bump type are set per design.
Silicon interposers
DRIE vias, insulating liner, barrier and seed, Cu fill and reveal, then damascene or semi-additive RDL. See TSV and RDL.
Glass interposers
Through-glass vias in borosilicate or alkali-free glass, lined or filled, with RDL on the metallized glass. See TGV and glass coupons.
Termination
UBM, Cu pillars with SnAg caps, solder or gold bumps sized to the mating die and substrate. See UBM and Cu pillar.
Dummy first
Where the layout is new, a dummy interposer with vias and daisy chains but no active routing qualifies the flow before the full design.
Silicon and Glass Interposer Prototyping
Scope and specification options. Every figure is confirmed for your program in the quotation.
Typical design ranges
Ranges we quote routinely; combinations at the limits are reviewed on your layout.
| Element | Silicon | Glass |
|---|---|---|
| Via diameter | 5-50 µm typical | 20 µm and up; 50-100 µm routine |
| Substrate thickness | 100-400 µm after thinning; thick substrates to ~1.5 mm | 300 µm to 1 mm |
| Via pitch | From 2× diameter, layout dependent | From 2× diameter |
| Via fill | Full Cu fill, void-free as verified by sampled cross section | Lined (open centre) or filled |
| RDL | 1-2 layers per face; damascene or semi-additive Cu | 1-2 layers per face on metallized glass |
| Line / space | 2/2 µm damascene; 5/5 µm semi-additive | 5/5 µm and up |
| Formats | 100-300 mm wafers | 100-200 mm wafers; panel on inquiry |
GDS review to diced parts
- 01Manufacturability reviewVia sizes, pitches, keep-out zones, RDL rules and pad openings checked against the ranges above; a marked-up report comes back with the questions.
- 02Test vehicle or dummy lotFor a new layout, a short lot with vias and daisy chains proves fill, reveal and RDL before the full design runs.
- 03Via formation and fillDRIE or glass via formation, liner and barrier, seed and Cu fill, CMP.
- 04RedistributionFront-face RDL, temporary bonding and thinning where required, reveal and back-face RDL.
- 05Termination and singulationUBM and bumps, electrical test on daisy chains where designed in, dicing to your die size.
- 06DeliveryWafers or identified diced parts with the inspection data in the quotation.
For a manufacturability review
| Item | What helps |
|---|---|
| GDS | All layers with a layer map; die size and count per wafer |
| Stack-up | Core material and thickness, RDL layer count per face, dielectric preference, pad finish |
| Via and RDL rules | Via diameter and pitch, minimum line and space, keep-outs |
| Electrical needs | Daisy chains or test structures for continuity, resistance and isolation |
| Quantity and stage | Dummy lot, prototype, pilot; wafer or diced delivery; target date |
Questions engineers ask before ordering
Can you review my GDS before I order?
Yes. Via sizes, pitches, keep-outs, RDL rules and pad openings are checked and a marked-up report comes back before any quotation.
Silicon or glass?
Silicon for fine via pitch and damascene RDL; glass for RF, photonics and low-loss applications. Both are quoted on the same page.
Can you deliver diced interposers?
Yes, as identified diced parts with the inspection data agreed in the quotation.
Processes usually combined with this work
Start your project.
Initial response within one business day.
Share your process requirements, substrate, and production volume. A Nanosystems JP Inc. engineer gives an initial response, typically within one business day. A written quotation typically follows within 7-10 business days after we receive the required information and complete any prerequisite NDA.