Glass Wafer
Processing Services
Holes, cavities, patterns and metal on glass: borosilicate, fused silica, crystalline quartz, ULE and alkali-free glass, as wafers, panels, windows and coupons. Laser and ultrasonic drilling, wet and dry etching, polishing, thin-film patterning and bonding, from one piece.
from
range
500 × 600 mm
order
Structures, surfaces and films
Schematic; hole profile, depth and roughness are confirmed per glass type.
Through-glass vias and holes
Laser-induced etching and laser or ultrasonic drilling for 20 µm vias to millimetre ports, straight, tapered or conical; arrays to full-wafer count. See TGV.
Cavities and channels
HF-based wet etching and dry etching of fused silica and borosilicate for microfluidic channels, optical recesses and cavities. See etching.
Polishing and thinning
Double-side polishing, thinning and edge finishing for wafers, windows and coupons; roughness and flatness reported.
Metal and ITO patterning
Lift-off and subtractive metal etching, ITO, Au and Ti/Au patterns on one or both faces with front-to-back overlay.
Bonding
Glass-to-silicon anodic and glass-to-glass fusion or adhesive bonding. See anodic bondingMEMS Cap Wafers.
Special glass
ULE and other low-expansion glass, thick substrates to 2 mm, laser windows and optical flats handled with dedicated fixtures.
Glass Wafer Processing Services
Scope and specification options. Every figure is confirmed for your program in the quotation.
Typical ranges
Values depend on glass composition and thickness; the quotation states the figures for your part.
| Feature | Typical | Note |
|---|---|---|
| Glass types | Borosilicate, alkali-free, fused silica, crystalline quartz, ULE, TCO-coated glass | Customer glass reviewed |
| Thickness | 100 µm to 2 mm | Thicker on inquiry |
| Vias | 20 µm and up; aspect ratio to ~10:1 filled, ~20:1 open | Profile per method |
| Etching | Wet HF for cavities to hundreds of µm; dry etch for fine features | Mask type per depth |
| Polishing | Roughness and flatness per specification | Measured per lot |
| Patterning | Line and space from 1 µm; double-sided overlay to ~5 µm | See fused silica window work |
| Formats | Pieces, wafers to 300 mm, panels to 500 × 600 mm | Per process |
For a glass quotation
| Item | What helps |
|---|---|
| Glass | Type and grade, thickness, format and size, who supplies it |
| Features | Dimensioned drawing: holes, cavities, patterns, tolerances |
| Surface | Roughness and flatness requirements, which faces matter |
| Downstream | Bonding, metallization or coating that follows |
| Quantity | Pieces and target date |
Processes usually combined with this work
Questions engineers ask before ordering
Can you coat customer-supplied glass?
Yes. Customer glass is reviewed for composition and condition, then processed as wafers, panels, windows or coupons.
Which glass types?
Borosilicate, alkali-free, fused silica, crystalline quartz, ULE and TCO-coated glass; others on inquiry.
Can you drill a single window?
Yes, from one piece; laser or ultrasonic drilling with straight, tapered or conical profiles.
Start your project.
Initial response within one business day.
Share your process requirements, substrate, and production volume. A Nanosystems JP Inc. engineer gives an initial response, typically within one business day. A written quotation typically follows within 7-10 business days after we receive the required information and complete any prerequisite NDA.