Thin-Film Temperature
Sensor Fabrication
Platinum thin-film RTDs and custom thermocouple structures fabricated to your substrate and layout: silicon, glass, ceramic or polyimide film. Nominal resistance, operating range, temperature coefficient, electrical screening and any temperature calibration are specified separately for the selected film stack.
options
from
film, substrate and contacts
order
Sensors where you need them, not where a package allows
Schematic: RTD terminals for four-wire measurement, a thermocouple with its two lead terminals (reference junction handled at the readout), and the passivation tint over the elements. Geometry and metal system follow the substrate and temperature range.
Platinum RTDs
Meander elements with a nominal 100 Ω or 1000 Ω at 0 °C, annealed for a stable temperature coefficient; on silicon, glass and AlN. The measured coefficient, tolerance and range are reported for the stack, not implied from the name.
NiCr and alloy resistors for sensing
NiCr and similar films are primarily heater and resistor materials; some grades have a very low temperature coefficient. They can be characterized for embedded sensing or heater feedback on the same chip, with the alloy, film and measured sensitivity stated per program.
Thin-film thermocouples
Dissimilar-metal junctions (Sb/Bi, Cu/constantan-type, Pt/Pt-Rh) patterned by lift-off, including arrays on polyimide for surface mapping; each pair has its own fabrication and temperature review, and a NiCr/Ni pair is a custom pair unless its alloys and response match a recognized type. Reference-junction treatment and readout are agreed with the layout. See the flexible substrate page.
Integration
Passivation, contact overlays, solderable pads and dicing; sensors integrated into heater chips, microchannel structures or your own device flow.
Thin-Film Temperature Sensor Fabrication
Scope and specification options. Every figure is confirmed for your program in the quotation.
Typical ranges
Sensor performance depends on substrate, film and anneal; the quotation states what is measured and how.
| Parameter | Typical | Note |
|---|---|---|
| Substrates and range | Si with oxide, glass, fused silica, AlN, polyimide film | The usable temperature range is set by the whole stack: substrate, adhesion and passivation, contacts, atmosphere and exposure time; polyimide builds are limited by the film, not the metal |
| RTD metals | Pt (sputtered or evaporated), NiCr, Ni | Adhesion layer per substrate |
| Thermocouple pairs | Sb/Bi, Cu/constantan-type, Pt/Pt-Rh; NiCr/Ni as a custom pair | Seebeck response characterized by agreement; reference-junction treatment, lead and pad materials stated per design |
| Line width | 20 µm and up by lift-off; finer on request | Meander design per resistance |
| Film thickness | 100 nm to 1 µm | Set for resistance and stability |
| Nominal resistance | 100 Ω or 1000 Ω at 0 °C, or custom | Temperature coefficient, tolerance and trimming reported per program; two-, three- or four-wire configuration and excitation current agreed for the readout |
| Passivation | SiO₂, SiN or Al₂O₃; polyimide on flexible parts | Optional |
| Electrical screening | Resistance measured on every element at a stated reference temperature | Establishes the electrical value at that condition, not a temperature-response curve |
| Temperature characterization or calibration | Available by agreement: R(T) over the agreed range, number of points, reference method, uncertainty, drift and hysteresis checks as specified | Reporting scope defined in advance in the quotation |
From drawing to characterized sensors
- 01Define the sensorType, range, resistance, substrate, contact layout.
- 02LayoutElement and pad geometry; GDS returned for approval.
- 03FabricateDeposition and lift-off, anneal, passivation, contacts.
- 04Screen and characterizeResistance of every element at a stated reference temperature; temperature characterization where agreed.
- 05DeliverDiced or on wafer, with data and identification.
For a sensor quotation
| Item | What helps |
|---|---|
| Sensor | RTD or thermocouple, target resistance or pair, operating range |
| Substrate | Material, size, whether you supply it |
| Layout | Element positions, pad positions, connection method |
| Environment | Chemical exposure, cycling, passivation needs |
| Characterization | Required range, number of points, reference method and report content; RTD wiring (two-, three- or four-wire) and thermocouple reference-junction arrangement |
Questions engineers ask before ordering
Do you calibrate the sensors?
Every element is screened electrically at a stated reference temperature. Temperature characterization or calibration is quoted separately, with points, reference method and reporting scope defined in advance.
Can you fabricate sensors on my own substrate?
Yes, on silicon, glass, fused silica, AlN or polyimide film after a review of the surface and thermal budget.
Which sensor type should I choose?
Platinum RTDs for stable, well-characterized resistance thermometry; NiCr-type resistors only where a characterized embedded element is acceptable; thin-film thermocouples where a junction measurement or an array is needed.
Processes usually combined with this work
Start your project.
Initial response within one business day.
Share your process requirements, substrate, and production volume. A Nanosystems JP Inc. engineer gives an initial response, typically within one business day. A written quotation typically follows within 7-10 business days after we receive the required information and complete any prerequisite NDA.