Flip-Chip Bonding
and Assembly Services
Die-to-substrate, die-to-wafer and die-to-interposer flip-chip assembly: thermocompression for Cu pillar and Au, reflow for SnAg, AuSn eutectic for photonics and hermetic parts, with alignment, underfill and electrical verification on daisy-chain structures. From single dies to pilot lots, in one program with the bumping that precedes it.
class, reviewed per bonder and part
reviewed geometries
order
systems
Bonding chosen by the bump, not the other way round
The bump system decides the bonding route: Cu pillar and Au bumps bond by thermocompression, SnAg by reflow, AuSn by eutectic reflow or thermocompression. We quote the assembly together with the bumping so the two are designed as one.
Schematic, not to scale: a face-down die on its bumps over substrate pads, with optional underfill. Bump system, pitch and stand-off are set by the design; alignment and joint inspection are agreed per program.
Thermocompression
Cu pillar with SnAg cap, Au stud and Au bumps, Au-Au and Cu-Cu joints; force, temperature and time per bump system; used for fine pitch and for photonics where flux is excluded.
Reflow
SnAg and other solder bumps with flux or fluxless routes; mass reflow after placement for larger pitches and quantities.
AuSn eutectic
Fluxless AuSn for lasers, photonics and hermetic assemblies, with the profile set for the stack. See AuSn bumping.
Die-to-wafer and interposer
Dies placed on wafers or interposers for 2.5D and 3D stacks, with daisy-chain dies to qualify the joint before product. See test dies.
Flip-Chip Bonding and Assembly Services
Scope and specification options. Every figure is confirmed for your program in the quotation.
Typical ranges
Achievable accuracy and yield depend on bump system, die size, substrate flatness and quantity; the quotation states the values for your parts.
| Parameter | Typical | Note |
|---|---|---|
| Die size | 0.5 mm to 25 mm edge | Thin dies with carrier handling |
| Substrates | Silicon and glass interposers, ceramic, organic laminates, wafers to 200 mm | Flatness reviewed |
| Bump systems | Cu pillar + SnAg, SnAg, AuSn, Au, indium | Pitch from 20 µm on reviewed geometries |
| Placement accuracy | ±2 µm class with high-accuracy bonders; coarser routes for larger pitch | Stated per part |
| Process | Thermocompression, reflow, eutectic; fluxless routes available | Atmosphere per bump system |
| Underfill | Capillary or no-flow; none for hermetic or photonic parts as required | Material per thermal budget |
| Verification | Daisy-chain continuity and resistance, X-ray, cross section, shear test | As agreed |
From bumped parts to verified assemblies
- 01DefineDie and substrate, bump system, pitch, accuracy, underfill, verification.
- 02BumpBumping and UBM if not already present, on our pages for each system.
- 03Place and bondAlignment to marks, thermocompression, reflow or eutectic bonding.
- 04Underfill and cureWhere specified; none for hermetic or photonic parts.
- 05Verify and deliverDaisy-chain and inspection per agreement; assemblies in trays.
Questions engineers ask before ordering
Can you bump and assemble in one program?
Yes. That is the normal case: the bump system and the bonding route are designed together, and daisy-chain dies qualify the joint before product parts are committed.
Fluxless assembly for photonics?
Yes, by thermocompression or AuSn eutectic routes with no flux, and without underfill where the optical path or hermeticity requires it.
What do you need to quote?
Die and substrate drawings, bump system or pad finish on both sides, pitch and count, accuracy requirement, underfill preference, verification needs, quantity and date.
Processes usually combined with this work
Start your project.
Initial response within one business day.
Share your process requirements, substrate, and production volume. A Nanosystems JP Inc. engineer gives an initial response, typically within one business day. A written quotation typically follows within 7-10 business days after we receive the required information and complete any prerequisite NDA.