Piranha, SC-1, SC-2
and RCA Cleaning Services
The standard wet cleans, run as a service on your wafers: piranha for organics and resist residue, SC-1 for particles, SC-2 for metallic contamination, HF for native oxide, and the full RCA sequence before epitaxy, oxidation, bonding or metallization. Chosen for your material and the films already on the wafer.
diameters
piranha, SC-1, SC-2, HF
check as agreed
order
Four baths, four jobs
Every wet clean is a trade-off between what it removes and what it attacks. The table below is the short version; the review before a lot checks your films and structures against each bath.
A representative sequence, schematic. The order and the baths used depend on the incoming contamination and the films present; not every wafer needs every step.
| Clean | Chemistry | Removes | Watch out for |
|---|---|---|---|
| Piranha | H₂SO₄ : H₂O₂, hot | Organics, resist and polymer residue; leaves a thin chemical oxide | Attacks most metals and many polymers; not for wafers with exposed Al, Cu or photoresist structures that must survive |
| SC-1 (APM) | NH₄OH : H₂O₂ : H₂O | Particles and light organics by mild oxide etch and lift-off | Slow silicon etch and surface roughening if over-processed; not for exposed Al |
| SC-2 (HPM) | HCl : H₂O₂ : H₂O | Metallic and ionic contamination | Mild; usually follows SC-1 |
| HF or BOE | Dilute HF | Native and chemical oxide; leaves a hydrogen-terminated surface | Removes SiO₂ films and undercuts oxide; timing matters |
| Full RCA | SC-1, HF, SC-2 in sequence | The pre-oxidation, pre-epitaxy and pre-bonding standard | Sequence and HF step selected per surface |
Piranha, SC-1, SC-2 and RCA Cleaning Services
Scope and specification options. Every figure is confirmed for your program in the quotation.
What we clean and how it is checked
| Parameter | Typical | Note |
|---|---|---|
| Materials | Si, SOI, SiC, sapphire, glass, fused silica, quartz, GaAs and InP with compatible chemistry | III-V and metallized wafers reviewed per bath |
| Wafer size | 2 to 12 inch; pieces and coupons | Cassette or single-wafer handling |
| Use cases | Resist and residue removal, pre-epitaxy, pre-oxidation, pre-bonding, pre-metallization, fluorine or organic contamination removal | Sequence per use case |
| Drying | Spin-rinse dry, IPA or Marangoni per surface and structure | Released MEMS by critical point drying |
| Verification | Particle count, water contact angle, optical inspection; XPS, TXRF or EDX by agreement | Criteria stated in the quotation |
| Turnaround | Short lots typically within days once received | Confirmed in the quotation |
From incoming wafer to verified surface
- 01ReviewMaterial, films present, contamination type, what must survive, downstream step.
- 02SequenceBaths, order, times and drying chosen; coupon trial for unusual stacks.
- 03CleanWet processing in the agreed sequence with controlled rinse and dry.
- 04VerifyInspection per criteria: particles, contact angle, residue; analytics by agreement.
- 05DeliverWafers in cleaned cassettes or single-wafer carriers.
Questions engineers ask before ordering
Can you piranha-clean a wafer with metal on it?
Usually no: piranha attacks most metals. We review the exposed films and choose SC-1, solvent or plasma routes where metal must survive.
Do you clean SiC and sapphire?
Yes. Both are chemically robust, so the full RCA and piranha sequences are available; the review concerns the films and the contamination, not the substrate.
What do you need to quote?
Material, size and quantity, the films and structures present, the contamination you want removed, the process that follows, and the cleanliness criterion you need.
Processes usually combined with this work
Start your project.
Initial response within one business day.
Share your process requirements, substrate, and production volume. A Nanosystems JP Inc. engineer gives an initial response, typically within one business day. A written quotation typically follows within 7-10 business days after we receive the required information and complete any prerequisite NDA.