Stealth and Laser
Dicing Services
Stealth dicing for silicon and glass up to 300 mm, laser dicing and grooving for brittle and low-k materials, and blade dicing where it is the right tool. For thin wafers, MEMS and photonics dies, glass interposers and SiC, from one wafer, with the process chosen for your material and die size.
wafer diameter to
stealth dicing
from, on carrier or frame
order
Three laser routes and when each one wins
Stealth dicing focuses a laser inside the wafer and separates dies by tape expansion: no kerf loss, no water, no chipping on the front side. Laser grooving opens a channel through metal or low-k layers before a blade finishes the cut. Full laser dicing ablates through thin or brittle material where a blade would chip it.
Schematic, not to scale: the laser is focused below the surface to form a modified layer; the frame tape is expanded to separate the dies. Layer count and expansion are set for the material and thickness.
Stealth dicing
Silicon and glass wafers to 300 mm, thin wafers on frame, MEMS with released structures and photonic dies where a wet blade cut is not acceptable.
Laser grooving plus blade
Wafers with test structures, metal or low-k in the streets; the groove removes the delaminating layers and the blade cuts the silicon cleanly.
Full laser dicing
Glass, fused silica, sapphire, SiC and very thin wafers where chipping and cracking would follow a blade; profile and edge quality reviewed per material.
SDBG for thin dies
Stealth dicing before grinding: the modified layer is formed first, the wafer is thinned on a carrier, and the dies separate at the target thickness without handling a thin wafer through a saw.
Stealth and Laser Dicing Services
Scope and specification options. Every figure is confirmed for your program in the quotation.
Typical ranges
Values are typical process windows; edge quality, die strength and chipping criteria are agreed per program.
| Parameter | Typical | Note |
|---|---|---|
| Wafer diameter | 2 to 12 inch (50 to 300 mm), pieces and panels | Frame and tape per diameter |
| Materials | Si, SOI, glass, fused silica, quartz, sapphire, SiC, GaAs, InP | Laser parameters per material |
| Thickness | 50 µm to 1 mm; SDBG to 50 µm | Carrier or frame support below ~200 µm |
| Die size | From about 0.3 mm; any rectangle, plus non-rectangular by laser | Street width per method, from ~20 µm for stealth |
| Kerf | Near zero for stealth; laser groove and blade per recipe | Measured on request |
| Front side | Stealth and laser keep the front dry; bumped and patterned wafers reviewed | Protective film where needed |
| Delivery | On frame or tape, in trays or gel packs, sorted by map | Inspection per agreed criteria |
From wafer to sorted dies
- 01ReviewMaterial, thickness, streets, die size, front-side condition, target edge quality.
- 02RecipeMethod chosen and, for a new material, a coupon trial with edge inspection.
- 03Mount and diceFrame mounting, stealth or laser processing, blade where specified.
- 04SeparateTape expansion or blade finish; thinning first for SDBG flows.
- 05Inspect and deliverChipping and edge check per criteria; trays, gel packs or frame with a map.
Questions engineers ask before ordering
Can you dice 300 mm glass wafers?
Yes, by stealth or laser routes, with the process set for the glass type and thickness; edge quality is reviewed on a coupon before the lot.
Can you dice a wafer that already has bumps?
Yes. Stealth and laser routes keep the front dry; bumped and patterned front sides are reviewed for protection and for the street layout.
What do you need to quote?
Wafer material, diameter and thickness, die size and street width, front-side condition, delivery format, quantity and date. A wafer map or GDS helps but is not required for the first answer.
Processes usually combined with this work
Start your project.
Initial response within one business day.
Share your process requirements, substrate, and production volume. A Nanosystems JP Inc. engineer gives an initial response, typically within one business day. A written quotation typically follows within 7-10 business days after we receive the required information and complete any prerequisite NDA.